Organic Substrate Packaging Material Market Size, Share, Trends, Analysis, Growth & Forecast to 2025

 According to IMARC Group’s latest report, titled “Organic Substrate Packaging Material Market Size: Industry Trends, Share, Growth, Opportunity and Forecast 2020-2025,” the global organic substrate packaging material market to continue its moderate growth during the next five years.

Organic substrate packaging materials are the base materials that are utilized on the foundation layer of printed circuit boards (PCBs) to provide high reliability and enhanced electrical performance. Small outline (SO) packages, grid array (GA) packages, flat no-leads packages, quad flat package (QFP), dual in-line package (GIP), etc., are some of the common variants of organic substrate packaging materials. They are widely adopted across diverse industries, such as consumer electronics, automotive, manufacturing, healthcare, etc.

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Market Trends

The rising demand for semiconductor packaging due to the increasing adoption of portable electronic devices is primarily driving the market for organic substrate packaging materials. Furthermore, the growing popularity of miniaturized electronic devices across the healthcare, aviation, and military and defense sectors is also catalyzing the market growth. Moreover, the emergence of autonomous vehicles has augmented the use of organic substrate packaging materials in millimeter-wave automotive radar systems to detect obstacles. Additionally, the introduction of high-density, ultra-thin organic substrates with higher performance rate will continue to the drive the market for organic substrate packaging materials in the coming years.

Organic Substrate Packaging Material Market 2020-2025 Analysis and Segmentation:

Competitive Landscape:

  • Amkor Technology Inc. (NASDAQ: AMKR)
  • ASE Kaohsiung (Advanced Semiconductor Engineering Inc.)
  • Compass Technology Co. Ltd. (SHE: 300803)
  • Hitachi Chemical Company Ltd. (Hitachi and Showa Denko)
  • Kyocera Corporation (TYO: 6971)
  • Mitsubishi Corporation (TYO: 8058)
  • NGK Spark Plug Co. Ltd. (TYO: 5334)
  • Shinko Electric Industries Co. Ltd. (Fujitsu) (TYO: 6967)
  • STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.)
  • WUS Printed Circuit Co. Ltd. (TPE: 2316)

Breakup by Technology:

  • Small Outline (SO) Packages
  • Grid Array (GA) Packages
  • Flat no-leads Packages
  • Quad Flat Package (QFP)
  • Dual in-line Package (GIP)
  • Others

Breakup by Application:

  • Consumer Electronics
  • Automotive
  • Manufacturing
  • Healthcare
  • Others

Breakup by Region:

  • North America (United States, Canada)
  • Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, Others)
  • Europe (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
  • Latin America (Brazil, Mexico, Others)
  • Middle East and Africa

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As the novel coronavirus (COVID-19) crisis takes over the world, we are continuously tracking the changes in the markets, as well as the industry behaviours of the consumers globally and our estimates about the latest market trends and forecasts are being done after considering the impact of this pandemic.

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IMARC’s information products include major market, scientific, economic and technological developments for business leaders in pharmaceutical, industrial, and high technology organizations. Market forecasts and industry analysis for biotechnology, advanced materials, pharmaceuticals, food and beverage, travel and tourism, nanotechnology and novel processing methods are at the top of the company’s expertise.

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